SFM3

■ 2 Spindles/Head x 2 Gantry

■ Speed : 7,000 UPH (Optimum)

■ Accuracy : ±5μm @ 3σ 

■ Die Size : □0.5 ~ □32mm 

■ Die Thickness : Min. 40μm

■ Wafer Size : up to 12”

■ Substrate Size : 330(L) x 330(W)mm (1 Conveyor) 330(L) x 166(W)mm (2 Conveyor)

■ Dimensions : 1,681(W) x 1,460(D)mm

■ %MCEPASTEBIN%